Alfa Chemistry Materials 7 - Products
Alfa Chemistry Materials is specialized in material chemistry and offers an extensive catalog of materials in a wide range of applications, including Metals and Materials, 3D Printing Materials, Biomaterials.
| Product | Description | |
|---|---|---|
| Tin (II) Sulfide (SnS) Sputtering Targets | Tin (II) Sulfide (SnS) Sputtering Targets. Alternative Names: Tin (II) Sulfide (SnS) Sputtering Targets, SnS Sputtering Target, SnS Sputter Target, SnS Target, Tin (II) Sulfide Sputtering Target, Tin (II) Sulfide Sputter Target, Tin (II) Sulfide Target. Purity: 99.9%-99.99%. |  |
| Ti-Ni-Nb Shape Memory Alloys | Ti-Ni-Nb Shape Memory Alloys. Alternative Names: Ti-Ni-Nb Shape Memory Alloys, TiNiNb Shape Memory Alloys, Ti-Ni-Nb SMAs, TiNiNb SMAs. | |
| Tin IV Nitride Nano Powder | Tin IV Nitride Nano Powder. CAS No. 13826-70-5. Molecular formula: Sn(NO3)4. Mole weight: 366.71g/mol. Purity: 99.9%. | |
| Tin(IV) Oxide Nanoparticle Dispersion | Tin(IV) Oxide Nanoparticle Dispersion. CAS No. 18282-10-5. Mole weight: 150.69. IUPAC Name: dioxotin. SMILES: O=[Sn]=O. InChI: InChI=1S/2O.Sn. | |
| Tin(IV) Sulfide (SnS2) | Tin(IV) Sulfide (SnS2). Alternative Names: Tin(IV) Sulfide Powder, SnS2 Powder, tin disulphide; tin(IV) sulphide; tin disulfide; tin sulfide; tin sulphide; tin(IV) sulfide. Purity: 99.999%. | |
| Tin (IV) Sulfide (SnS2) Sputtering Targets | Tin (IV) Sulfide (SnS2) Sputtering Targets. Alternative Names: Tin (IV) Sulfide (SnS2) Sputtering Targets, SnS2 Sputtering Target, SnS2 Sputter Target, SnS2 Target, Tin (IV) Sulfide Sputtering Target, Tin (IV) Sulfide Sputter Target, Tin (IV) Sulfide Target. Purity: 99.95%-99.99%. | |
| Tin Lead Alloy Nanoparticles | Tin Lead Alloy Nanoparticles. Molecular formula: Sn:Pb. Purity: 99.9 %. | |
| Tin Metal Organic Framework | Tin Metal Organic Framework. CAS No. 7440-31-5. Mole weight: 150.71 g/mol. | |
| Tin Nanoparticle Dispersion | Tin Nanoparticle Dispersion. Mole weight: 118.69. SMILES: [Sn]. InChI: InChI=1S/Sn. | |
| Tin Nanoparticles | Tin Nanoparticles. | |
| Tin Nanoparticles/Nanopowder | Tin Nanoparticles/Nanopowder. Purity: 99.7%. | |
| TiN nanopowder | TiN nanopowder. Purity: 99%. | |
| Tin Nanoprisms | Tin Nanoprisms. CAS No. 7440-31-5. Mole weight: 118.69. SMILES: [Sn]. InChI: InChI=1S/Sn. | |
| Tin Niobate (SnNb2O6) Sputtering Targets | Tin Niobate (SnNb2O6) Sputtering Targets. Alternative Names: Tin Niobate (SnNb2O6) Sputtering Targets, SnNb2O6 Sputtering Target, SnNb2O6 Sputter Target, SnNb2O6 Target, Tin Niobate Sputtering Target, Tin Niobate Sputter Target, Tin Niobate Target. Purity: 99.99%. | |
| Tin Oxide | Tin(IV) Oxide (Stannic Oxide, or Tin Dioxide) is a highly insoluble thermally stable Tin source suitable for glass, optic and ceramic applications. Tin oxide is a colorless inorganic compound of tin and oxygen and has two forms, a stable blue-black form and a metastable red form. Alternative Names: Stannic oxide, tin(4+) oxide, dioxotin, stannic dioxide, stannane, oxo-, tin dioxide, stanic anhydride, CAS 1332-29-2, cassiterite, tin peroxide. CAS No. 18282-10-5. Molecular formula: SnO2. Mole weight: 150.69. Purity: 99%|99.9%|99.99%|99.999%. InChI: InChI=1S/2O.Sn. | |
| Tin Oxide Dispersion | Tin Oxide Dispersion. CAS No. 18282-10-5. Molecular formula: SnO2. Purity: 99.9 %. | |
| Tin Oxide Dispersion | Tin Oxide Dispersion. CAS No. 21651-19-4. Molecular formula: SnO2. Purity: 99.9%. | |
| Tin oxide nanoparticles | Tin oxide nanoparticles. | |
| Tin Oxide Nanopowder | Tin Oxide Nanopowder. CAS No. 18282-10-5. Molecular formula: SnO2. Mole weight: 150.71g/mol. Purity: 99.9%. | |
| Tin Oxide nano powder (100 nm) | Tin Oxide nano powder (100 nm). Purity: 99.9%. | |
| Tin Oxide nano powder (80 nm) | Tin Oxide nano powder (80 nm). Purity: 99.9%. | |
| Tin Oxide Nanowires Properties | Tin Oxide Nanowires Properties. CAS No. 18282-10-5. Mole weight: 150.69. Purity: (99%, 99.9%, 99.99%). | |
| Tin Oxide (SnO2) | Tin Oxide (SnO2). Alternative Names: Tin Oxide Powder, SnO2 Powder, tin dioxide; tin(IV) oxide; stannic oxide; tin oxide. Purity: 99.999%. | |
| Tin Oxide (SnO2) Sputtering Targets | Tin Oxide (SnO2) Sputtering Targets. Alternative Names: Tin Oxide (SnO2) Sputtering Targets, SnO2 Sputtering Target, SnO2 Sputter Target, SnO2 Target, Tin Oxide Sputtering Target, Tin Oxide Sputter Target, Tin Oxide Target. Purity: 99.99%. | |
| Tin Selenide (SnSe) | SnSe has a layered structure (layered) with weak interlayer coupling and can be isolated into a single layer. Each monolayer is four atoms thick (Se-Sn-Sn-Se), approximately 0.9-1.0 nm. Alternative Names: Tin Selenide Powder, SnSe Powder, tin selenide; tin(II) selenide; stannous selenide. Purity: 99.9999% confirmed purity. | |
| Tin Selenide (SnSe) Sputtering Targets | Tin Selenide (SnSe) Sputtering Targets. Alternative Names: Tin Selenide (SnSe) Sputtering Targets, SnSe Sputtering Target, SnSe Sputter Target, SnSe Target, Tin Selenide Sputtering Target, Tin Selenide Sputter Target, Tin Selenide Target. Purity: 99.9%. | |
| Tin Silver Paste | Tin Silver Paste. Molecular formula: SnAg. Purity: 99.9%. | |
| Tin (Sn) | Tin (Sn). Alternative Names: High Purity Tin (Sn); 99.99% Tin (Sn); 99.999% Tin (Sn); 99.9999% Tin (Sn). Purity: 4N-6N. | |
| Tin (Sn) Sputtering Targets | Tin (Sn) Sputtering Targets. Alternative Names: Tin (Sn) Sputtering Targets, Sn Sputtering Target, Sn Sputter Target, Sn Target, Tin Sputtering Target, Tin Sputter Target, Tin Target. Purity: 99.99%. | |
| Tin Tantalate (SnTa2O6) Sputtering Targets | Tin Tantalate (SnTa2O6) Sputtering Targets. Alternative Names: Tin Tantalate (SnTa2O6) Sputtering Targets, SnTa2O6 Sputtering Target, SnTa2O6 Sputter Target, SnTa2O6 Target, Tin Tantalate Sputtering Target, Tin Tantalate Sputter Target, Tin Tantalate Target. Purity: 99.99%. | |
| Tin Telluride (SnTe) | Tin Telluride (SnTe). Alternative Names: Tin Telluride Powder, SnTe Powder, tin telluride; tin(II) telluride; stannous telluride. Purity: 99.999%. | |
| Tin Telluride (SnTe) Sputtering Targets | Tin Telluride (SnTe) Sputtering Targets. Alternative Names: Tin Telluride (SnTe) Sputtering Targets, SnTe Sputtering Target, SnTe Sputter Target, SnTe Target, Tin Telluride Sputtering Target, Tin Telluride Sputter Target, Tin Telluride Target. Purity: 99.9%-99.99%. | |
| Tin Zinc (Sn-Zn) Alloy Sputtering Targets | Tin Zinc (Sn-Zn) Alloy Sputtering Targets. Alternative Names: Tin Zinc (Sn-Zn) Alloy Sputtering Targets, Sn-Zn Alloy Sputtering Target, Sn-Zn Alloy Sputter Target, Sn-Zn Alloy Target, Tin Zinc Alloy Sputtering Target, Tin Zinc Alloy Sputter Target, Tin Zinc Alloy Target. Purity: 99.9%-99.999%. | |
| TiO2 | TiO2. Purity: 99%. | |
| TiO2 Nanoparticles | TiO2 Nanoparticles. CAS No. 13463-67-7. Molecular formula: TiO2. Mole weight: 79.866 g/mol. Purity: 99.9 %. | |
| TiO2 Nanoparticles | TiO2 Nanoparticles. | |
| TiO2 nanopowder | TiO2 nanopowder. Purity: 99%. | |
| TiO2 Nanotubes | TiO2 Nanotubes. CAS No. 13463-67-7. Molecular formula: TiO2. Mole weight: 79.866 g/mol. Purity: 99.9%. | |
| titania nanofiber urchin | titania nanofiber urchin. | |
| Titania nanowire A | Titania nanowire A. | |
| Titania nanowire B | Titania nanowire B. | |
| Titania nanowire coating ink | Titania nanowire coating ink. | |
| Titania nanowire Industry A | Titania nanowire Industry A. | |
| Titania nanowire Industry B | Titania nanowire Industry B. | |
| Titania Nanowires | Titania Nanowires. | |
| Titanium Aluminide Powder | Titanium Aluminide Powder. CAS No. 12004-78-3. Molecular formula: TiAl3. Mole weight: 128.81 g/mol. Purity: 99.9%. | |
| Titanium Aluminium Carbide Powder | Titanium Aluminium Carbide Powder. CAS No. 196506-01-1. Molecular formula: Ti3AlC2. Mole weight: 194.605g/mol. Purity: 99%. | |
| Titanium Aluminium Nitride Nanopowder | Titanium Aluminium Nitride Nanopowder. Molecular formula: TiAlN. Purity: >99.9%. | |
| Titanium Aluminum (Ti-Al) Alloy Sputtering Targets | Titanium Aluminum (Ti-Al) Alloy Sputtering Targets. Alternative Names: Titanium Aluminum (Ti-Al) Alloy Sputtering Targets, Ti-Al Alloy Sputtering Target, Ti-Al Alloy Sputter Target, Ti-Al Alloy Target, Titanium Aluminum Alloy Sputtering Target, Titanium Aluminum Alloy Sputter Target, Titanium Aluminum Alloy Target. Purity: 99.9%. | |
| Titanium Aluminum Vanadium (Ti-Al-V) Alloy Sputtering Targets | Titanium Aluminum Vanadium (Ti-Al-V) Alloy Sputtering Targets. Alternative Names: Titanium Aluminum Vanadium (Ti-Al-V) Alloy Sputtering Targets, Ti-Al-V Alloy Sputtering Target, Ti-Al-V Alloy Sputter Target, Ti-Al-V Alloy Target, Titanium Aluminum Vanadium Alloy Sputtering Target, Titanium Aluminum Vanadium Alloy Sputter Target. Purity: 99.9%. | |
| Titanium Boride/Boron Carbide nanoparticles | Titanium Boride/Boron Carbide nanoparticles. | |
| Titanium Boride/Boron Carbide/Tungsten Boride nanoparticles | Titanium Boride/Boron Carbide/Tungsten Boride nanoparticles. | |
| Titanium Boride nanoparticles | Titanium Boride nanoparticles. | |
| Titanium Boride (TiB2) | Titanium Boride (TiB2). Alternative Names: High Purity Titanium Boride (TiB2); 99.9% Titanium Boride (TiB2); 99.99% Titanium Boride (TiB2); ; high purity titanium diboride; high purity titanium boride. Purity: 3N-4N. | |
| Titanium Boride (TiB2) Sputtering Targets | Titanium Boride (TiB2) Sputtering Targets. Alternative Names: Titanium Boride (TiB2) Sputtering Targets, TiB2 Sputtering Target, TiB2 Sputter Target, TiB2 Target, Titanium Boride Sputtering Target, Titanium Boride Sputter Target, Titanium Boride Target. Purity: 99.5%. | |
| Titanium Carbide Nanoparticle Dispersion | Titanium Carbide Nanoparticle Dispersion. Mole weight: 59.89. SMILES: [Ti].C. InChI: InChI=1S/CH4.Ti/h1H4. | |
| Titanium Carbide Nanoparticles | Titanium Carbide Nanoparticles. | |
| Titanium Carbide (TiC) | Titanium Carbide (TiC). Alternative Names: High Purity Titanium Carbide (TiC); 99.9% Titanium Carbide (TiC); 99.99% Titanium Carbide (TiC); ; high purity titanium(IV) carbide; high purity titanium carbide. Purity: 3N-4N. | |
| Titanium Carbide (TiC) Sputtering Targets | Titanium Carbide (TiC) Sputtering Targets. Alternative Names: Titanium Carbide (TiC) Sputtering Targets, TiC Sputtering Target, TiC Sputter Target, TiC Target, Titanium Carbide Sputtering Target, Titanium Carbide Sputter Target, Titanium Carbide Target. Purity: 99.5%. | |
| Titanium Carbonitride nanoparticles | Titanium Carbonitride nanoparticles. | |
| Titanium Carbo-Nitride Nanopowder | Titanium Carbo-Nitride Nanopowder. CAS No. 12654-86-3. Molecular formula: Ti2CN. Mole weight: 121.75g/mol. Purity: 99.9 %. | |
| Titanium Carbonitride (TiCN) Sputtering Targets | Titanium Carbonitride (TiCN) Sputtering Targets. Alternative Names: Titanium Carbonitride (TiCN) Sputtering Targets, TiCN Sputtering Target, TiCN Sputter Target, TiCN Target, Titanium Carbonitride Sputtering Target, Titanium Carbonitride Sputter Target, Titanium Carbonitride Target. Purity: 99.5%. | |
| Titanium coated Carbon Nanotubes | Titanium coated Carbon Nanotubes. | |
| Titanium Cobalt (Ti-Co) Alloy Sputtering Targets | Titanium Cobalt (Ti-Co) Alloy Sputtering Targets. Alternative Names: Titanium Cobalt (Ti-Co) Alloy Sputtering Targets, Ti-Co Alloy Sputtering Target, Ti-Co Alloy Sputter Target, Ti-Co Alloy Target, Titanium Cobalt Alloy Sputtering Target, Titanium Cobalt Alloy Sputter Target, Titanium Cobalt Alloy Target. Purity: 99.9%-99.95%. | |
| Titanium diboride (?i?2) | Titanium diboride (?i?2). | |
| Titanium Diboride Nanopowder | Titanium Diboride Nanopowder. CAS No. 12045-63-5. Molecular formula: TiB2. Mole weight: 69.489 g/mol. Purity: 99.9 %. | |
| Titanium Diboride (TiB2) Powder | Titanium Diboride (TiB2) Powder. Alternative Names: titanium diboride; titanium boride. CAS No. 7789-75-5. Purity: 99.%. | |
| Titanium Dioxide Dispersion Anatase | Titanium Dioxide Dispersion Anatase. CAS No. 13463-67-7. Molecular formula: TiO2. Purity: >99.99%. | |
| Titanium Dioxide Dispersion Rutile | Titanium Dioxide Dispersion Rutile. CAS No. 13463-67-7. Molecular formula: TiO2. Purity: >99.99%. | |
| Titanium dioxide nanoparticles | Titanium dioxide nanoparticles. | |
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